TOYO336、High bird I-wheel、MH11:The material uses aviation aluminum, around the cutting wire labor word wheel, the high purity monocrystalline silicon rod cut into wafers.
133、160、165:The I-wheel used for winding the tungsten wire of diamond wire and forming diamond wire is used for cutting silicon wafer, sapphire and semiconductor.
Specific type of small drawing wheel:WS9、WS18、WS34、WS50 The specific type of big pull I-wheel:WS550、WS1000:Copper-plated single steel wire reciprocating use of I-wheel, used in the steel cord industry.
PV600/DW200、SJ80 、 BS245/BS333、 Steel and aluminum alloy312:Diamond wire labor word wheel, used for cutting silicon wafer, sapphire, semiconductor.
BS64(TA20)、BS126(TA40) 、BS200(TA100):It is used for winding diamond wire. This wire is plated with diamond and becomes diamond wire, used for cutting silicon wafer, sapphire, semiconductor.
Sumitomo A40、D53(Kiswire) 、G360-70 、G240-40、C63(kiswire):Cbar wire rough pull labor wheel, used in steel cord industry.